System for cooling an electronic image assembly with manifolds and ambient gas
US8755021B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 24, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Nov 2, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/36
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system for cooling an electronic image assembly using ambient gas. The system contains a plurality of channels place behind the electronic image assembly and preferably in conductive thermal communication with the image assembly. Ambient gas is ingested into the display housing and directed to a first manifold which distributes the ambient gas to the plurality of channels. A second manifold preferably collects the ambient gas from the channels after absorbing heat from the electronic image assembly and/or channels. The second manifold then preferably directs the ambient gas towards an exit aperture and out of the display housing. Circulating gas may also be used to cool a front portion of the electronic image assembly. A cross through plate may be used to allow the ambient gas and circulating gas to cross paths without mixing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.