Semiconductor module
US8755185B2 · kind B2 · utility
7Cited by
3References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2010 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | May 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes an upper arm and a lower arm of an inverter circuit. The upper arm has a switching element and a rectifying device and the lower arm has a switching element and a rectifying device. The upper arm and the lower arm are laminated such that the switching elements overlap each other and the rectifying devices overlap each other. Refrigerant flow paths constituting cooling sections respectively extend along both sides in the lamination direction of the switching elements and the rectifying devices and are folded back at the rectifying device lamination section side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.