Housing of electronic device and electronic device
US8755190B2 · kind B2 · utility
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21Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Jun 17, 2014 |
| Priority date | — |
| Expiry date | Apr 12, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1616
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A housing of an electronic device includes a first housing body, a second housing body and a buffer. The first housing body defines an accommodating recess. The second housing body is assembled to the first housing body and adapted to be foldable relative to the first housing body. The buffer is disposed on the second housing body. In a closed position, the second housing body and the first housing body are stacked with each other, the accommodating recess is recessed away from the second housing body, the buffer faces the first housing body, and the buffer substantially overlaps with a fringe of the accommodating recess.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.