Method for manufacturing a read head having conductive filler in insulated hole through substrate
US8756795B1 · kind B1 · utility
34Cited by
25References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2012 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a read head includes the step of depositing a conductive filler into a plurality of holes that extend through a wafer. Each of the holes extends from a wafer top surface to a wafer bottom surface. Each of the holes includes an inner surface that includes an insulative layer. The method further includes the steps of fabricating a read transducer on the wafer top surface, and depositing a plurality of electrically conductive leading connection pads on the wafer bottom surface. The plurality of electrically conductive leading connection pads are in electrical contact with the conductive filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.