Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
US8756802B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Dec 31, 2012 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Dec 31, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49206
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of making carbon nanotube contact structures on an electronic device includes growing a plurality of carbon nanotube columns on a mandrel. Electrically-conductive adhesive is applied to ends of the columns distal from the mandrel, and the columns are transferred to the electronic device. An electrically-conductive material is deposited onto some or all of the columns. The mandrel can be reused to grow a second plurality of carbon nanotube columns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.