Patent · US Active

Resilient floor

US8756899B2 · kind B2 · utility

97Cited by
129References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 4, 2013
Grant dateJun 24, 2014
Priority date
Expiry dateJan 4, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49623
  • WIPO fieldCivil engineering
  • WIPO sectorOther fields

Abstract

A method of assembling resilient floorboards is disclosed that includes the step of bending an edge of a floorboard during the assembling. The bending reduces the force required for connection of the edge to another edge of a juxtaposed floorboard.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.