Bending device
US8756971B2 · kind B2 · utility
0Cited by
2References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 3, 2012 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Dec 24, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21D43/105
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A bending device includes a bending mechanism for holding an elongated workpiece between a bending die and a clamping die revolvable around the bending die, and revolving the clamping die, to thereby bend the workpiece. The bending device includes a fixing base on which the bending mechanism is mounted, and an articulated robot on which a chuck mechanism for holding the workpiece is mounted and which moves the chuck mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.