Bonding structure manufacturing method, heating and melting treatment method, and system therefor
US8757474B2 · kind B2 · utility
5Cited by
17References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jun 24, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering method capable of alleviating positional displacement between substrates even though a step of removing flux can be omitted is provided.A temporary bonding agent 55 is applied onto multiple substrates 50a, 50b, and a heater 33 heats the substrates while the substrates are temporarily bonded with the temporary bonding agent 55 interposed therebetween, and before the solder 54 is melted or while the solder 54 is melted, the temporary bonding agent 55 is evaporated, and the substrates 50a, 50b are bonded with solder with the melted solder 54 interposed therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.