Method of fabricating a timepiece balance spring assembly in micro-machinable material or silicon
US8757868B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 20, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Oct 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49609
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabricating a balance spring assembly (1) in silicon including a hairspring (2) made in a wafer of given crystalline orientation, in a plane (P). The volume of the assembly (1) is broken down into sub-components, inscribed in parallelepiped prisms, in secant pairs, at the junction areas, perpendicular to each other, each made in a wafer selected for the thickness or crystalline orientation thereof. An outer curve (4) is made in an orthogonal plane to that of the hairspring (2) joining it directly to a point in space, the projection of which into the plane (P) is located external to the hairspring (2). The sub-components are assembled at the junction areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.