Patent · US Active

Method of fabricating a timepiece balance spring assembly in micro-machinable material or silicon

US8757868B2 · kind B2 · utility

3Cited by
6References
12Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 20, 2011
Grant dateJun 24, 2014
Priority date
Expiry dateOct 22, 2032

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/49609
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method of fabricating a balance spring assembly (1) in silicon including a hairspring (2) made in a wafer of given crystalline orientation, in a plane (P). The volume of the assembly (1) is broken down into sub-components, inscribed in parallelepiped prisms, in secant pairs, at the junction areas, perpendicular to each other, each made in a wafer selected for the thickness or crystalline orientation thereof. An outer curve (4) is made in an orthogonal plane to that of the hairspring (2) joining it directly to a point in space, the projection of which into the plane (P) is located external to the hairspring (2). The sub-components are assembled at the junction areas.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.