Method for changing a mold
US8758001B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2010 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jan 3, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/7158
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is a molding device for a machine for producing containers consisting of a thermoplastic material by forming a pre-heated preform using at least one pressurized fluid. The device includes: two mold carriers mounted in such a way that they can move in relation to each other about a rotational axis, between an open position and a closed position; two mold halves that each have a half-impression, are carried by a mold carrier, and are respectively mounted in the associated mold carrier; and fixing element that can dismountably fix each mold half, in its mounted position, to the mold carrier. The element for fixing each mold half to the mold carrier, which are mounted in such a way that they can move at least between a fixing position and a release position, can be controlled as they move between the positions when the mold carriers are in the closed position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.