System for connecting a first substrate to a second substrate
US8758026B2 · kind B2 · utility
1Cited by
14References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2013 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 15, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/73
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect apparatus for interconnecting electrical components includes a body and a spring element retained by and extending from the body. The apparatus is configured so that a portion thereof may be captured between first and second substrates and to connect electrical circuits lying in different planes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.