Patent · US Active

Method of attaching elements by bonding

US8758534B2 · kind B2 · utility

0Cited by

3References

13Claims

0Family size

Assignee

SAAB AB · SE

Inventors

Björn Weidmann · Borensberg, SE
Anders Westerdahl · Säter, SE

Key dates

Filing date	Dec 19, 2008
Grant date	Jun 24, 2014
Priority date	—
Expiry date	Mar 13, 2030

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB64C3/26
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A method of attaching a first portion and a second portion to each other. An adhesive is exposed to a low temperature in order to obtain a non-tacky adhesive. The non-tacky adhesive is arranged between the two portions. The adhesive is cured. Use of adhesive according to the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.