Patent · US Active

One component epoxy resin composition

US8758549B2 · kind B2 · utility

0Cited by

11References

10Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Pablo Walter · Cologne, DE
Mustapha Benomar · Duisburg, DE
Stefan Kreiling · Düsseldorf, DE
Angelika Troll · Goldkronach, DE
Rainer Schoenfeld · Goldkronach, DE

Key dates

Filing date	Nov 5, 2012
Grant date	Jun 24, 2014
Priority date	—
Expiry date	Nov 5, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08J2363/00
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.