Debonders and related devices and methods for semiconductor fabrication
US8758552B2 · kind B2 · utility
14Cited by
16References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2010 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | May 20, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1978
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.