Fixtures and methods for unbonding wafers by shear force
US8758553B2 · kind B2 · utility
9Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2010 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Feb 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are systems, devices and methodologies for separating wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be separated or unbonded from the carrier plate. Such a separation process can be achieved by applying a mechanical shear force to the wafer-carrier plate assembly. Various devices and methodologies, and related features, are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.