Electroplating apparatus
US8758577B2 · kind B2 · utility
0Cited by
57References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2012 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Oct 12, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for electroplating a rotogravure cylinder out of a plating solution having a concentration of copper ions wherein the cylinder is connectable to a current source is provided. The system includes a plating apparatus configured to copper plate the cylinder comprising a non-dissolvable anode, a plating tank configured to receive the cylinder, a controller configured to control operation of the apparatus, and a tube for delivering a mixture of a hardener and the plating solution to the plating tank.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.