Device and method for microstructured plasma treatment
US8758697B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2009 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/2431
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a device for the microstructured plasma treatment of a film substrate, especially of a plastic film. Said device comprises a rotatably received cylindrical electrode the surface of which contains or consists of metal, especially chromium, the surface having microstructured depressions, a planar high-voltage electrode the surface of which has a shape complementary to that of the cylindrical electrode and can be arranged on a section of the surface of the cylindrical electrode in a substantially form-fit manner, a transport device for transporting the film substrate to be treated between the surface of the cylindrical electrode and the high-voltage electrode, and a device for feeding a process gas to the surface of the cylindrical electrode and to the interspace between the cylindrical electrode and the high-voltage electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.