Thermally conductive foam product
US8758892B2 · kind B2 · utility
25Cited by
11References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 2010 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jun 16, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249986
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A compressible, thermally conductive foam interface pad is adapted for emplacement between opposed heat transfer surfaces in an electronic device. One heat transfer surface can be part of a heat-generating component of the device, while the other heat transfer surface can be part of a heat sink or a circuit board. An assembly including the foam interface pad and the opposed electronic components is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.