Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
US8759211B2 · kind B2 · utility
1Cited by
2References
2Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 11, 2013 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes applying, between connection conductors of adjacent substrates, a junction material containing the first metal or alloy component and the second metal or alloy component having a higher melting point than said first metal or alloy component. The method further includes melting the junction material by a heat treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.