Printed circuit board providing heat dissipation
US8759686B2 · kind B2 · utility
0Cited by
6References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes an insulated base sheet, a heat-conducting layer, an insulated layer, a plurality of heat-conducting blocks, and a plurality of bonding pads. The heat-conducting layer is disposed on the insulated base sheet. The insulated layer is partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon. The heat-conducting blocks are correspondingly formed on the exposed zones. The bonding pads are positioned on the heat-conducting layer for soldering circuit elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.