Manufacturing and use of microperforated substrates
US8759707B2 · kind B2 · utility
1Cited by
7References
46Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 30, 2005 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jan 14, 2027 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB26F1/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to methods and devices for the production of micro-structured substrates and their application in natural sciences and technology, in particular in analysis and detection systems based on artificial and biological lipid membranes. The structure is preferably a hole or a cavity or channel and is obtained by spark perforation. Energy, preferably heat, is applied to the region to be structured so as to reduce the amplitude of voltage required and/or soften the material. The electrical parameters of the spark perforation are feedback-controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.