Patent · US Active

Process and device for form locked joining of two components

US8759710B2 · kind B2 · utility

8Cited by

3References

8Claims

0Family size

Assignee

LPKF LASER & ELECTRONICS AG · DE

Inventors

Frank Brunnecker · Memmelsdorf, DE
Alexander Hofmann · Hanau, DE

Key dates

Filing date	May 11, 2007
Grant date	Jun 24, 2014
Priority date	—
Expiry date	May 12, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/107
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

A process is described for form locking joining of two components through plastic deformation of one of the two components. In order for the tool for forming the form locking connection not to get in direct contact with the plasticized area of the joining partners, a third component between the tool and the two components to be joined through form locking is being used, which simultaneously enters into an adhesive bond with one of the two components to be joined through form locking. The thermal energy for creating the plastic state of one of the joining partners and for developing the adhesive bond is applied through electromagnetic radiation through the third component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.