Light emitting diode chip, light emitting diode package structure, and method for forming the same
US8759865B2 · kind B2 · utility
8Cited by
16References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
Abstract
A light emitting diode chip, a light emitting diode package structure and a method for forming the same are provided. The light emitting diode chip includes a bonding layer, which has a plurality of voids, or a minimum horizontal distance between a surrounding boundary of the light emitting diode chip and the bonding layer is larger than 0. The light emitting diode chip, the light emitting diode package structure and the method may improve the product yields and enhance the light emitting efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.