Electronic device and method of manufacturing the same
US8759884B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jul 7, 2009 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jul 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K59/871
Abstract
An electronic device comprises a functional stack (10) and a cover (50) coupled thereto by an insulating adhesive layer (30). The functional stack (10) comprises a first transparent and electrically conductive layer (22), a second electrically conductive layer (24) and a functional structure (26), comprising at least one layer, sandwiched between said first and second conductive layer.The cover (50) includes a substrate (52) and at least a first conductive structure (66, 68) that is arranged in a first plane between the adhesive layer (28) and the substrate (52). First and second transverse electrical conductors (32, 34) transverse to the first plane (61) electrically interconnect the first and the second electrically conductive layer (22, 24) with the first and the second conductive structure (66, 68) in the first plane (61).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.