Electronic component including a shielding metal film disposed on a resin layer
US8759953B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2006 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Apr 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an electronic component, an active chip element and a passive chip element are respectively enclosed within first and second resin layers, which are separately disposed on upper and lower surfaces of a core substrate, respectively. The first resin layer includes a shielding metal film disposed on an upper surface thereof and a first via-hole conductor which connects the shielding metal film with a circuit pattern provided on the core substrate. The second resin layer includes an external-terminal electrode disposed on a lower surface thereof and a second via-hole conductor which connects the external-terminal electrode with a circuit pattern provided on the core substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.