Substrate structure and method of manufacturing the same
US8759986B2 · kind B2 · utility
3Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 6, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a substrate structure including: a base substrate on which a conductive pattern is formed; a first plating layer covering the conductive pattern; and a second plating layer covering the first plating layer, wherein the first plating layer includes an electroless reduction plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.