Patent · US Active

Method for producing semiconductor components, and corresponding semiconductor component

US8759988B2 · kind B2 · utility

0Cited by

0References

3Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Mathias Bruendel · Stuttgart, DE
Frieder Haag · Wannweil, DE
Ulrike Scholz · Ditzingen, DE

Key dates

Filing date	May 27, 2011
Grant date	Jun 24, 2014
Priority date	—
Expiry date	May 27, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for producing semiconductor components and a component obtainable by such a method is disclosed. The method comprises the following steps: fixing a conductive film on a carrier; adhesively bonding semiconductor chips onto the conductive film using an adhesive layer, wherein active surfaces of the semiconductor chips, the active surfaces having connection contacts, are situated on that side of the chips which faces the film; overmolding the chips adhesively bonded onto the conductive film with a molding compound; and releasing the conductive film with the overmolded chips from the carrier. In this case, the adhesive layer is structured in such a way that at least connection contacts of the semiconductor chips are free of the adhesive layer and are kept free of the molding compound.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.