Disk drive head gimbal assembly having a jumper in a flexible printed circuit overlap region
US8760812B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2013 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Mar 12, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/323
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A head stack assembly (HSA) for a disk drive includes a flexible printed circuit (FPC). The FPC includes a plurality of electrically conductive FPC traces, each leading to a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminated flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. The laminated flexure includes a flexure tail having an overlap region that overlaps the FPC. A structural layer of the laminated flexure includes a jumper in the overlap region. The jumper is electrically connected to at least two of the plurality of flexure electrical traces in the flexure conductive layer. The jumper is disposed at least 50 microns from any of the plurality of FPC electrical traces or FPC bond pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.