Electrochemical device and manufacturing method thereof, circuit board and housing tray
US8760840B2 · kind B2 · utility
1Cited by
4References
41Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2011 |
| Grant date | Jun 24, 2014 |
| Priority date | — |
| Expiry date | Jun 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lead 3 of an electrochemical device includes a lead body 3A containing Al, and a bent metallic thin film 3a provided to a tip part of the lead body 3A. The metallic thin film 3a includes a thin film body 3a1 containing Ni, and a plating layer 3a2 containing Sn and covering at least an outer surface of the bent thin film body 3a1. A specific area of an inner surface of the bent thin film body 3a1 and a surface of the lead body 3A are welded in a predetermined area without the plating layer 3a2 being disposed there between.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.