Zero thermal expansion, low heat transfer, variable temperature sample assembly for probe microscopy

US8763161B2 · kind B2 · utility

Assignee

• The United States of America, as Represented by the Secretary of Commerce National Institute of Standards and Technology · US

Inventors

• Rachel Cannara · Kirkland, US
• Fred Sharifi · Niskayuna, US
• Zhao Deng · Gaithersburg, US

Key dates

• Filing date: Sep 19, 2012
• Grant date: Jun 24, 2014
• Expiry date: Jan 9, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S977/871
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A variable temperature assembly for scanning probe microscopy (SPM) is described which minimizes or eliminates motion of the sample caused by the thermal expansion or contraction of the sample holder assembly and platform/scanning stage on which the assembly is mounted, and minimizes heating or cooling of the platform/stage. In heater form, the variable temperature assembly includes a thin boron nitride puck with one or more high-resistivity wires embedded along an underside of the puck. The puck is suspended from its polished top surface by posts that are secured to the microscope stage. All thermal expansion of the puck occurs in the downward direction, away from the SPM probe-sample interface, thus eliminating relative motion between the probe tip and sample surface. The top surface of the puck remains stationary as a result of the unique geometry of the posts and the puck-post attachment configuration described herein.