Method for bonding substrates in an energy assisted magnetic recording head
US8763235B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Dec 27, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53261
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for bonding a first substrate to a second substrate is described. The first substrate includes a first plurality of solder pads, a first alignment mark set, and a first plurality of dots. The second substrate includes a second plurality of solder pads, a second alignment mark set, and a second plurality of dots configured to interlock with the first plurality of dots. The method includes aligning the first alignment mark set with the second alignment mark set. The first alignment mark sets being aligned corresponds to the dots and the solder pads being aligned. The method also includes locking the first plurality of dots with the second plurality of dots to form an interlocking key. The method also includes reflowing at least one of the first and second pluralities of solder pads. The dots remain substantially solid during the reflow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.