Method of fabricating touch panel
US8763237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 2013 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Aug 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4916
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a touch panel is provided. A substrate having a touch-sensing region and a peripheral region is provided. A touch-sensing circuit layer including first sensing series, and second meshed metal sensing pads is formed on the touch-sensing region of the substrate. An insulating layer having first contact windows is formed on the substrate to cover the touch-sensing circuit layer. The first contact windows expose a portion of the second meshed metal sensing pads. A plurality of second transparent bridge lines are formed on the insulating layer located in the touch-sensing region. Each second transparent bridge line is electrically connected to two adjacent second meshed metal sensing pads through two first contact windows. The second transparent bridge lines completely cover the portion of the second meshed metal sensing pads exposed by the first contact windows.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.