Diamond bonded construction with improved braze joint
US8763730B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 28, 2009 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Dec 16, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12229
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Diamond bonded constructions comprise a body comprising a plurality of bonded together diamond grains with interstitial regions disposed between the grains that are substantially free of the catalyst material used to initially sinter the body. A metallic substrate is attached to the body, and a braze joint is interposed between the body and the substrate. The body is metallized to include a metallic material disposed along a substrate attachment surface in contact with the braze joint, wherein the metallic material is different from the braze joint material. The metallic material may exist within a region of the body extending fully or partially into the body, and/or may exist as a layer extending away from the substrate attachment surface. The body includes a working surface characterized by empty interstitial regions or by interstitial regions filled with an infiltrant material, wherein the infiltrant material is different from the metallizing material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.