Dual interface module and dual interface card having a dual interface module
US8763912B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2013 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Mar 29, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A dual interface module comprises a substrate layer having at least two first through-holes, two contact pads on a first side of the substrate, at least two connection pads on a second side of the substrate, at least one electronic element on the second side of the substrate, an antenna pad comprising an antenna on the second side of the substrate, at least two first connection elements in the first through-holes, each first element electrically connecting one of the contact pads with one of the connection pads, at least two second connection elements, each second element electrically connecting one of the connection pads with the electronic element, and two third connection elements, each third element electrically connecting the electronic element with the antenna pad. The module can be arranged on a plastic card body or in a cavity in a plastic card body to form a dual interface card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.