Shape memory thermal sensors
US8764286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Mar 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49863
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
Embodiments of separating apparatuses are generally described herein. Other embodiments may be described and claimed. In one embodiment, a thermal sensor assembly includes a shape memory substrate anchored within an isolation housing and braced between first and second anchors. The shape memory substrate is configured to transition from the strained configuration to the fractured configuration at a specified temperature range, and the first substrate end fractures from the second substrate end at the specified temperature. In another embodiment, a fracture indicator is coupled with the shape memory substrate, and the fracture indicator is configured to indicate the fractured configuration corresponding to meeting or exceeding of the specified temperature. In one example, the specified temperature range includes a range of temperatures or a single temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.