Mold apparatus
US8764433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 25, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Jun 25, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/7393
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a mold apparatus, and according to an aspect of the present disclosure, there is provided a mold apparatus including a cavity mold comprising a cavity mold plate formed with a cavity at a front surface thereof and provided with a heating means at an inner portion thereof, and a cooling plate brought into contact with or separated from a rear surface of the cavity mold plate and provided with a cooling means at an inner portion thereof; and a core mold configured to determine the cavity together with the cavity mold plate, wherein the cooling plate is formed with at least two or more divided surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.