Method of promoting adhesion and bonding of structures and structures produced thereby
US8764929B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Jun 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The disclosure provides in one embodiment a method of promoting adhesion on a composite surface. The method comprises providing a composite structure having at least one composite surface to be bonded. The method further comprises preparing the at least one composite surface. The method further comprises providing a chemical derivatization compound containing active functional groups that promote adhesion. The method further comprises depositing the chemical derivatization compound on the prepared composite surface to form a functional group-adhesive promoter derivatized layer. The method further comprises applying an adhesive layer to the derivatized layer. The method further comprises heat curing the adhesive layer to result in a bond with another structure made of a composite, a metal, or a combination thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.