Manufacturing methods for metal clad laminates
US8764960B2 · kind B2 · utility
8Cited by
9References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2007 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Jun 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to the manufacturing method of metal clad laminates by forming a conductive layer on a single side or both sides of a material film that is made of an insulating material using the silver complexes having a unique structure and electroplating metals outside of said conductive layer. The present invention can provide the manufacturing method of metal clad laminates, which has a fast operation speed for mass production, simple process steps to minimize defective ratio and cheap production cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.