Method of producing a semiconductor
US8765036B2 · kind B2 · utility
1Cited by
14References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 19, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Apr 29, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2083/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a semiconductor is disclosed. A mold is providing having an interior defining a planar capillary space. A measure of precursor is placed in fluid communication with the capillary space. The precursor is then melted, and the melted precursor is allowed to flow into the capillary space. The melted precursor is then allowed to cool to form a semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.