Patent · US Active

Molding compound comprising a polyester resin composition, film produced from the molding compound and method for producing a film or film web

US8765240B2 · kind B2 · utility

4Cited by

3References

29Claims

0Family size

Assignee

Kloeckner Pentaplast GmbH & Co. KG · DE

Inventors

Thorsten Grigo · Teising, DE
Max Niegl · Munich, DE
Guenter Deiringer · Burgkirchen an der Alz, DE

Key dates

Filing date	Mar 28, 2006
Grant date	Jul 1, 2014
Priority date	—
Expiry date	Aug 17, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/1352
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The invention relates to a molding compound including a polyester resin composition, ABS components, waxes, matting agents and optionally vegetable oil, which is used to produce films with a low luster, improved thermal resistance of the film and/or of the surface structure and an increased shrinking onset temperature, in addition to a modified shrinkage progression in comparison to films without the aforementioned additives. The fraction of the polyester resin composition is between 30 and 97 wt. % and the fraction of the additives between 1.5 and 70 wt. %, in relation to the total weight of the molding compound. The films are used as shrink-wrapping and packaging films and films for furniture and printed circuit boards.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.