Radiation sensitive resin composition, method for forming a pattern, polymer and compound
US8765355B2 · kind B2 · utility
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4References
7Claims
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Key dates
| Filing date | Apr 27, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Apr 27, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/027
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A radiation sensitive resin composition includes a first polymer having a group represented by a following formula (1), and a radiation sensitive acid generator. n is an integer of 2 to 4. X represents a single bond or a bivalent organic group. A represents a (n+1) valent linking group. Each Q independently represents a group that includes an alkali-dissociable group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.