Image sensors including hydrophobic interfaces and methods of fabricating the same
US8765517B2 · kind B2 · utility
1Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Oct 30, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8053
Abstract
A method of fabricating an image sensor device includes forming an insulating layer on a substrate including a photodiode therein, and forming a wiring structure on the insulating layer. The wiring structure includes at least one wiring layer and at least one insulating interlayer. A cavity is formed extending into the wiring structure over the photodiode to expose a surface of the at least one insulating interlayer. The surface of the at least one insulating interlayer exposed by the cavity is modified to define a hydrophobic surface. Related systems and devices are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.