Method of forming a metal pattern and method of manufacturing a display substrate including the metal pattern
US8765614B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Apr 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a metal pattern on a display substrate includes blanket depositing a copper-based layer having a thickness between about 1,500 Å and about 5,500 Å on a base substrate, and forming a patterned photoresist layer on the copper-based layer. The copper-based layer is over-etched by an etching composition containing an oxidizing moderating agent where the over-etch factor is between about 40% and about 200% while using the patterned photoresist layer as an etch stopping layer, and where the etching composition includes ammonium persulfate between about 0.1% by weight and about 50% by weight, includes an azole-based compound between about 0.01% by weight and about 5% by weight and a remainder of water. Thus, reliability of the metal pattern and that of manufacturing a display substrate may be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.