Thermosetting polymer-based composite materials
US8765856B2 · kind B2 · utility
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13References
12Claims
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Key dates
| Filing date | Apr 12, 2013 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Apr 12, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/019
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A lead-free, non-toxic composite material including a thermosetting polymer and at least one of a heavy particulate filler, a light particulate filler or a combination thereof. The composite material may be utilized in manufacturing articles used in radiation shielding applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.