Resin composition and resin molded product
US8765878B2 · kind B2 · utility
0Cited by
1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 23, 2013 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | May 23, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G63/692
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin composition including a compound in which a vinyl group in a side chain of a phosphazene compound is bonded to an α carbon in an aliphatic polyester resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.