Glass substrate laser cutting device with real-time breaking detecting function and glass substrate breakage detecting method thereof
US8766135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 6, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Nov 5, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03B33/091
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A glass substrate laser cutting device according to the invention includes: a working table that has a plurality of vacuum absorbing grooves; a laser cutter; a pressure sensor that measures a pressure sensor when suctioning the glass substrate in a vacuum state; a calculation processing unit that compares the vacuum pressure measured by the pressure sensor with a predetermined threshold pressure and determines whether the glass substrate is broken; a laser cutter that includes a leaser head moving along the cutting direction of the glass substrate and emitting a laser beam; and an optical sensor that is attached to the laser head so as to move together and is disposed at a point in front of the laser beam emitted to the outside so as to detect the breakage of the glass substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.