Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element
US8766381B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
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Key dates
| Filing date | Sep 12, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Feb 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.