Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same
US8766437B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 13, 2010 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Nov 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is provided an electrode structure to be electrically connected to a connection conductor by being bonded thereto with an anisotropic conductive adhesive mainly composed of a thermosetting resin, the electrode structure including an electrode for connection using an adhesive, the electrode being arranged on a base material, and an organic film serving as an oxidation preventing film configured to cover a surface of the electrode for connection using an adhesive, in which the organic film has a higher decomposition temperature than the maximum temperature of heat treatment to be performed. A wiring body and a connecting structure using an adhesive are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.