Printer device, temperature adjustment method of printer device, and temperature adjustment system of printer device
US8767025B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2012 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1121
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
The inside of a housing of a printer device is cooled by the air from a ventilation port and, consequently, the temperature of solder SP on a mask surface supported by a mask holding frame inside the housing can be kept low. Moreover, provided is a mask cover for blocking the air flow from the ventilation port toward the mask, and the drying of the solder SP caused by the wind from the ventilation port is thereby inhibited as a result of the wind from the ventilation port not coming into contact with the solder SP on the mask surface. In this way, the solder SP is cooled while inhibiting the drying of the solder SP and, consequently, it is possible to appropriately inhibit the change in viscosity of the solder SP, and favorable printing can be realized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.