Thermal management system for electrical components and method of producing same
US8767398B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 4, 2011 |
| Grant date | Jul 1, 2014 |
| Priority date | — |
| Expiry date | Mar 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10545
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.